Designed exclusively for 8th generation Intel Core processors to maximize connectivity and speed with Dual M.2, 802.11ac Wi-Fi, Gigabit LAN, USB 3.1 and Intel Optane Memory compatibility. Bluetooth V4.2
5-Way Optimization with Auto-Tuning and FanXpert 4 automatically tailors overclocking profiles to your unique build for maximum OC performance and dynamic system cooling
Unmatched Personalization with ASUS exclusive AURA Sync RGB lighting, two additional RGB headers, addressable RGB header and 3D printing mounts
Two Patent-pending Safe Slots feature an injection molding process that integrates metal framing for a stronger, firmly anchored PCIe slot built for heavyweight GPUs
Industry-leading 8-channel HD audio with dual headphone amplifiers and ROG exclusive SupremeFX S1220 CODEC driven by Japanese capacitors. NOTE: Refer the User Manual before use.
Aiming at the problems exist on the open sourced controller board such as Ramps 1.4, the developers in Makerbase specially optimize and develop a new product, MKS Gen_L, which provides more flexible choices for users.
2560 and Ramps 1.4 are integrated in the board, which avoids the complicated connectors.Support a variety of stepper drivers such as A4988, DRV8825, TMC2100 and LV8729, available to change the stepper drivers and motors as users like.
Reserve external driver signal, available to connect external high-current driver to drive the 57 and 86 stepper motors.
Use high-quality MOSFET, better cooling and more stable.Use specific power chip, support 12V-24V power input, and resolve the problems of chip heating and power shortage.Stable and reliable filter circuit greatly reduces interference and avoids crashes as possible in the process of printing.
Use CH340 serial port chip, more easily install the drive than 16U2.8. Run Marlin firmware, the configuration is completely same as Ramps 1.4, and available to directly replace the Ramps 1.4.Support Ramps 1.4, 2004LCD,12864LCD, TFT28 and TFT32.Available to input 24V, the heated bed current can be reduced to 1/4 at the same system power which effectively resolves the problem that the MOSFET of heated bed heats.